D&B Business Directory

Besi Switzerland AG

Joint   Stock   Company Subsidiary
Doing Business As
Besi Spares and Tooling Ltd
Hinterbergstrasse 32A Steinhausen ​,  ZUG , 6312 Switzerland See other locations
Company Description

Esec (formerly Oerlikon Assembly Equipment) makes manufacturing equipment used to assemble finished semiconductors. Its core business is making the die bonders, wire bonders, and flip chip bonders needed to lay down the itty bitty pathways on microchips. The company also makes equipment for assembling components and the packaging technology for smart cards. Oerlikon merged the formerly publicly traded ESEC into its Assembly Equipment division in 2004. The company has seven service centers located strategically in select Asian markets, as well as in Europe and the US. In 2009 Oerlikon sold Oerlikon Esec to rival BE Semiconductor Industries in a stock-swap transaction.

Key Principal
Richard W. Blickman See more contacts
Industrial Machinery Manufacturing Other General Purpose Machinery Manufacturing Professional and Commercial Equipment and Supplies Merchant Wholesalers Machinery, Equipment, and Supplies Merchant Wholesalers Sewing machines and hat and zipper making machinery Industrial furnaces and ovens Office equipment Industrial machinery and equipment Industrial supplies Transportation equipment and supplies See all industries
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Financial Data

Revenue in USD

Annual Revenue
$24.30 million USD
1 USD = 0.9259 CHF

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Company Snapshot

Essential information for a successful call

  • EMPLOYEES (This Site) 160
  • REVENUE (MIL USD) 24.3
  • Year Started 1968
  • Incorporated 1968

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Get in Touch with 7 Principals*

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  • Richard W. Blickman
    Managing Director and Chairman of the Board
  • Henriëtte Gerarda Everdina Maria van Kerkhof
    Member of the Board of Directors
  • Ruurd Boomsma
    Authorised Signatory
  • Michael Leu
    Authorised Signatory

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