Esec (formerly Oerlikon Assembly Equipment) makes manufacturing equipment used to assemble finished semiconductors. Its core business is making the die bonders, wire bonders, and flip chip bonders needed to lay down the itty bitty pathways on microchips. The company also makes equipment for assembling components and the packaging technology for smart cards.
See detailed business credit reports on other businesses or your own.
See detailed profiles for insights and prospects on this company's top competitors.
Similar Companies Nearby
Get in Touch with 7 Principals*
Richard W. BlickmanManaging Director and Chairman of the Board
Henriëtte Gerarda Everdina Maria van KerkhofMember of the Board of Directors
Ruurd BoomsmaAuthorised Signatory
Michael LeuAuthorised Signatory